MasterNanosciences, nanotechnologies

Prerequisite: Semiconductor Physics

Part I Nanofabrication in research labs:
This part will cover the main nanofabrication and characterization techniques used in clean-rooms in research laboratory and semi-industrial environments for the fabrication of current and future semiconductor devices. The principles of these techniques will be presented and illustrated through concrete examples obtained in the clean-rooms of the Minatech Campus in Grenoble. This course will provide you with the basics of technological steps, thin film deposition techniques, lithography processes, and advanced characterization used during the fabrication of single devices up to their large-scale integration.

Content :

• Substrates/Materials (Si / Ge / SiGe / SOI / sSOI / Si28 / III-V….)
• Surface preparation (Batch / Single Wafer – Baths / Sprays / Cryogenics /…)
• Thin film deposition of semiconductors, insulators and metals (PVD / CVD / ECD /…
• Lithography (Photo / E-beam / Imprint) and etching (Wet / Dry) processes
• Ion implantation
• Chemical Mechanical polishing
• Molecular bonding (Wafer to Wafer / Hybrid bonding / Die to wafer / ….)
• Characterisation techniques (SPM / SEM-EDX / XRF / Ellipsometry / XPS / XRF / PL / Raman / XRD / …)

Part II : VLSI nanofabrication processes :

Course Description: This second part of the course describes the devices that are currently used and developed to sustain Moore’s law: it spans transistor technologies from bulk CMOS, to FinFET and FDSOI, with a discussion of their pros and cons and how they are manufactured at scale. It also describes the evolution of Moore’s law, the challenges associated with dimension scaling, and how integration paradigms have shifted in the past and are still evolving to sustain continuous improvement of integrated circuit performance. With a strong focus on current research trends, we will look at the state-of-the-art as well as to where the microelectronics industry is shifting to support both classical and quantum computing.

Learning Objectives:

• Familiarity with the industrial microelectronic fabrication ecosystem
• Foundation in the fundamentals of device scaling
• Ability to read and evaluate research articles focused on VLSI
• Understanding of the bridge between microelectronics and quantum computing