PPHY538S Surface characterization techniques
- PPHY538S Surface characterization techniques - 3 ECTS elective course
Lecturers: Sirona Valdueza and Laurens Kwakman, 24h course
Prerequisites: Quantum mechanics, solid state physics, statistical physics.
To remain competitive, IC manufacturers have to accelerate the development of most advanced (CMOS) technology and to deliver high yielding products with best cycle times and at a competitive pricing. With the increase of technology complexity, also the need for physical characterization support increases, however many of the existing techniques are no longer adequate to effectively support the 65-32 nm technology node developments.
New and improved techniques are definitely needed to better characterize the often marginal processes, but these should not significantly impact fabrication costs or cycle times. Hence, characterization and metrology challenges in state-of-the-art IC manufacturing are both of technical and economical nature.
This course allows the student to develop an understanding of the role and importance of Physical
Characterization in the Microelectronics industry . In this course, the various, often very advanced analytical
techniques will be reviewed and explained. Both theory and practical use-cases will be covered and illustrated
through examples stemming from most recent, industrial CMOS technology development programs.
1. The Microelectronics Industry:
History, business challenges, technology challenges, trends and strategies
2. Characterization, Metrology & Failure Analysis:
Analytical needs, overview of existing techniques.
3. The device fabrication process :
65 nm CMOS process flow-chart explained, process steps to control.
TEM microscopy, TEM-EELS spectroscopy
5. Material Analysis:
Chemical Analysis (SIMS, μ-AES, ToF-SIMS, XRF) and structural Analysis (XRD, EBSD)
6. Transistor engineering and Strain Analysis:
TEM-CBED, μ-Raman spectroscopy
7. Copper and -low K dielectrics metallization schemes:
Analysis of Thermo-mechanical properties of materials (nano-indentation, Photo-accoustics, Ellipsometric
Porosimetry, X-ray reflectivity)
8. Metrology and FAB economics:
Queuing theory (cycletime vs. equipment utilization), metrology capability indicators, tool matching)